{"id":1779,"date":"2021-12-29T13:11:56","date_gmt":"2021-12-29T13:11:56","guid":{"rendered":"https:\/\/novanta.com\/precision-manufacturing\/?post_type=novanta_tech_paper&#038;p=1779"},"modified":"2026-07-24T15:55:20","modified_gmt":"2026-07-24T15:55:20","slug":"semiconductor-electronics-inspection","status":"publish","type":"novanta_tech_paper","link":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/","title":{"rendered":"Semiconductor Electronics Inspection"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\" id=\"h-technical-paper-overview-nbsp\">Technical Paper Overview&nbsp; <\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"h-optimal-processing-of-polypropylene-films-with-co\u2082-lasers\"><strong>Optimal Processing of Polypropylene Films with CO\u2082 Lasers<\/strong><\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">&nbsp;Polypropylene film is the workhorse of modern flexible packaging and labels \u2014 clear or opaque, single-layer or laminated. Most converters cutting PP run the standard 10.6 \u00b5m CO\u2082 wavelength because that&#8217;s what most CO\u2082 lasers ship with. They also live with yellowed cut edges, scored bottom liners, and cut speeds that cap line throughput well below what the laser is theoretically capable of.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">This technical paper from the Novanta Applications Lab derives the physics of why polypropylene&#8217;s C-C bond produces an absorption peak at 10.27 \u00b5m \u2014 and documents the gains from switching Synrad p150 lasers to the 10.2 \u00b5m wavelength: 22% speed gain on 140 \u00b5m laminated film, up to 80% on 80 \u00b5m PP, with yellowing and liner-scoring eliminated.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-key-takeaways-include\">Key takeaways include:<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Why polypropylene&#8217;s C-C molecular chemistry produces an absorption peak at 10.27 \u00b5m \u2014 matched by the 10.2 \u00b5m laser wavelength<\/li>\n\n\n\n<li>How a Synrad p150 at 10.2 \u00b5m delivers 22-80% cutting-speed gains over the same laser at 10.6 \u00b5m on identical PP samples<\/li>\n\n\n\n<li>When 10.2 \u00b5m becomes essential: selective perforation of multi-layer pouches (PP top \/ LDPE liner) without breaching the liner<\/li>\n\n\n\n<li>What edge-quality differences look like in production: side-by-side comparisons of opaque and clear PP at both wavelengths<\/li>\n\n\n\n<li>A practical PP-thickness-vs-speed-gain table converters can use to project ROI before purchase<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Download the full technical paper to get the polypropylene absorption-spectrum derivation, the thickness-versus-speed-gain table from the Novanta Applications Lab&#8217;s Synrad p150 testing, and side-by-side cut-edge comparisons \u2014 before specifying a CO\u2082 laser for your polypropylene label or packaging line.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Technical Paper Overview&nbsp; Optimal Processing of Polypropylene Films with CO\u2082 Lasers &nbsp;Polypropylene film is the workhorse of modern flexible packaging and labels \u2014 clear or opaque, single-layer or laminated. Most converters cutting PP run the standard 10.6 \u00b5m CO\u2082 wavelength because that&#8217;s what most CO\u2082 lasers ship with. They also live with yellowed cut edges, [&hellip;]<\/p>\n","protected":false},"author":342,"featured_media":4447,"template":"","meta":{"_acf_changed":false,"card_thumbnail_id":0,"show_table_of_content":true},"class_list":["post-1779","novanta_tech_paper","type-novanta_tech_paper","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v27.0 (Yoast SEO v27.4) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>AI Chip Packaging &amp; Semiconductor Inspection | Novanta<\/title>\n<meta name=\"description\" content=\"Learn how laser-based inspection supports AI chip packaging quality, complementing laser dicing and semiconductor laser processing on the line.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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Semiconductor Inspection | Novanta\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/resources\\\/whitepapers\\\/semiconductor-electronics-inspection\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/resources\\\/whitepapers\\\/semiconductor-electronics-inspection\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/wp-content\\\/uploads\\\/sites\\\/28\\\/2026\\\/04\\\/electronics_inspection-737x395-1.jpg\",\"datePublished\":\"2021-12-29T13:11:56+00:00\",\"dateModified\":\"2026-07-24T15:55:20+00:00\",\"description\":\"Learn how laser-based inspection supports AI chip packaging quality, complementing laser dicing and semiconductor laser processing on the line.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/resources\\\/whitepapers\\\/semiconductor-electronics-inspection\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/resources\\\/whitepapers\\\/semiconductor-electronics-inspection\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/resources\\\/whitepapers\\\/semiconductor-electronics-inspection\\\/#primaryimage\",\"url\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/wp-content\\\/uploads\\\/sites\\\/28\\\/2026\\\/04\\\/electronics_inspection-737x395-1.jpg\",\"contentUrl\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/wp-content\\\/uploads\\\/sites\\\/28\\\/2026\\\/04\\\/electronics_inspection-737x395-1.jpg\",\"width\":737,\"height\":395},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/resources\\\/whitepapers\\\/semiconductor-electronics-inspection\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Semiconductor Electronics Inspection\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/#website\",\"url\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/\",\"name\":\"Precision Manufacturing\",\"description\":\"\",\"publisher\":{\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/#organization\",\"name\":\"Precision Manufacturing\",\"url\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/wp-content\\\/uploads\\\/sites\\\/28\\\/2026\\\/05\\\/novanta-icon-512x512-1.png?quality=85&strip=all\",\"contentUrl\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/wp-content\\\/uploads\\\/sites\\\/28\\\/2026\\\/05\\\/novanta-icon-512x512-1.png?quality=85&strip=all\",\"width\":512,\"height\":512,\"caption\":\"Precision Manufacturing\"},\"image\":{\"@id\":\"https:\\\/\\\/novanta.com\\\/precision-manufacturing\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"AI Chip Packaging & Semiconductor Inspection | Novanta","description":"Learn how laser-based inspection supports AI chip packaging quality, complementing laser dicing and semiconductor laser processing on the line.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/","og_locale":"en_US","og_type":"article","og_title":"Semiconductor Electronics Inspection","og_description":"Learn how laser-based inspection supports AI chip packaging quality, complementing laser dicing and semiconductor laser processing on the line.","og_url":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/","og_site_name":"Precision Manufacturing","article_modified_time":"2026-07-24T15:55:20+00:00","og_image":[{"url":"https:\/\/novanta.com\/precision-manufacturing\/wp-content\/uploads\/sites\/28\/2026\/04\/electronics_inspection-737x395-1.jpg?quality=85&strip=all&w=737&h=395&crop=1","width":737,"height":395,"type":"image\/jpeg"}],"twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/","url":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/","name":"AI Chip Packaging & Semiconductor Inspection | Novanta","isPartOf":{"@id":"https:\/\/novanta.com\/precision-manufacturing\/#website"},"primaryImageOfPage":{"@id":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/#primaryimage"},"image":{"@id":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/#primaryimage"},"thumbnailUrl":"https:\/\/novanta.com\/precision-manufacturing\/wp-content\/uploads\/sites\/28\/2026\/04\/electronics_inspection-737x395-1.jpg","datePublished":"2021-12-29T13:11:56+00:00","dateModified":"2026-07-24T15:55:20+00:00","description":"Learn how laser-based inspection supports AI chip packaging quality, complementing laser dicing and semiconductor laser processing on the line.","breadcrumb":{"@id":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/#primaryimage","url":"https:\/\/novanta.com\/precision-manufacturing\/wp-content\/uploads\/sites\/28\/2026\/04\/electronics_inspection-737x395-1.jpg","contentUrl":"https:\/\/novanta.com\/precision-manufacturing\/wp-content\/uploads\/sites\/28\/2026\/04\/electronics_inspection-737x395-1.jpg","width":737,"height":395},{"@type":"BreadcrumbList","@id":"https:\/\/novanta.com\/precision-manufacturing\/resources\/whitepapers\/semiconductor-electronics-inspection\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/novanta.com\/precision-manufacturing\/"},{"@type":"ListItem","position":2,"name":"Semiconductor Electronics Inspection"}]},{"@type":"WebSite","@id":"https:\/\/novanta.com\/precision-manufacturing\/#website","url":"https:\/\/novanta.com\/precision-manufacturing\/","name":"Precision Manufacturing","description":"","publisher":{"@id":"https:\/\/novanta.com\/precision-manufacturing\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/novanta.com\/precision-manufacturing\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/novanta.com\/precision-manufacturing\/#organization","name":"Precision Manufacturing","url":"https:\/\/novanta.com\/precision-manufacturing\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/novanta.com\/precision-manufacturing\/#\/schema\/logo\/image\/","url":"https:\/\/novanta.com\/precision-manufacturing\/wp-content\/uploads\/sites\/28\/2026\/05\/novanta-icon-512x512-1.png?quality=85&strip=all","contentUrl":"https:\/\/novanta.com\/precision-manufacturing\/wp-content\/uploads\/sites\/28\/2026\/05\/novanta-icon-512x512-1.png?quality=85&strip=all","width":512,"height":512,"caption":"Precision Manufacturing"},"image":{"@id":"https:\/\/novanta.com\/precision-manufacturing\/#\/schema\/logo\/image\/"}}]}},"_links":{"self":[{"href":"https:\/\/novanta.com\/precision-manufacturing\/wp-json\/wp\/v2\/novanta_tech_paper\/1779","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/novanta.com\/precision-manufacturing\/wp-json\/wp\/v2\/novanta_tech_paper"}],"about":[{"href":"https:\/\/novanta.com\/precision-manufacturing\/wp-json\/wp\/v2\/types\/novanta_tech_paper"}],"author":[{"embeddable":true,"href":"https:\/\/novanta.com\/precision-manufacturing\/wp-json\/wp\/v2\/users\/342"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/novanta.com\/precision-manufacturing\/wp-json\/wp\/v2\/media\/4447"}],"wp:attachment":[{"href":"https:\/\/novanta.com\/precision-manufacturing\/wp-json\/wp\/v2\/media?parent=1779"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}