As AI-driven technologies accelerate, the demand for advanced semiconductor and laser manufacturing systems continues to grow. At our Wackersdorf, Germany, site, teams are engineering complex scan head subsystems that directly support these high-growth applications.
One focus area is laser additive manufacturing. The Wackersdorf team develops advanced scan head systems that integrate high-speed beam steering, precision optics, and sophisticated control algorithms. These systems rely on galvanometers and high-performance mirrors produced within our broader network, demonstrating how integrated expertise creates differentiated performance.
The engineering challenges are significant. Some configurations incorporate up to five axes of motion and advanced light path modeling to achieve extreme accuracy and repeatability. These are not commodity components; they are tightly integrated subsystems built to meet demanding industrial requirements.
Wackersdorf is also advancing micro-machining systems used in semiconductor probe card manufacturing. Probe cards, roughly the size of a credit card, can contain up to 100,000 microscopic holes used to test high-performance chips. Drilling these holes with the required precision demands advanced laser scanning capability and deep application expertise.
As semiconductor applications expand to support AI workloads, demand for such precision manufacturing tools is increasing.
In addition, the site is developing new scan head platforms for converting and packaging applications, further broadening its role in advanced manufacturing automation.
Wackersdorf’s strength lies in its ability to combine optics, motion control, and software into integrated, high-performance subsystems. As global markets evolve, that systems-level expertise becomes increasingly valuable.
